Product Detail
Product Tags
GB |
ISO |
ASTM |
JIS |
TU1 |
Cu-OF |
C10200 |
C1020 |
T2 |
Cu-RTP |
C11000 |
C1100 |
TP1 |
Cu-DLP |
C12000 |
C1201 |
TP2 |
Cu-DHP |
C12200 |
C1220 |
GB |
Composition(%) |
Cu |
P |
O |
Other |
TU1 |
99.97 |
0.002 |
less than 0.002 |
balance |
T2 |
99.9 |
- |
- |
balance |
TP1 |
99.9 |
0.004-0.012 |
- |
balance |
TP2 |
99.9 |
0.015-0.040 |
- |
balance |
ASTM |
Composition(%) |
Cu |
P |
O |
Other |
C10200 |
99.95 |
0.001-0.005 |
- |
balance |
C11000 |
99.9 |
- |
- |
balance |
C12000 |
99.9 |
0.004-0.012 |
- |
balance |
C12200 |
99.9 |
0.015-0.040 |
- |
balance |
Classification |
9 |
12 |
18 |
35 |
50 |
Width |
520 |
520 |
520 |
520 |
520 |
Purity(%) |
≧99.9 |
Density(g/m³) |
8.89 |
Area Weight(g/㎡) |
80±2 |
107±3 |
160±4 |
311±5 |
444±5 |
Tensile Strength(N/㎜²) |
Normal |
≧390 |
≧400 |
≧400 |
≧400 |
≧400 |
180℃30Min |
≧150 |
≧160 |
≧180 |
≧200 |
≧200 |
Elongation(%) |
Normal |
≧0.5 |
≧0.5 |
≧0.8 |
≧0.8 |
≧0.8 |
180℃30Min |
≧5 |
≧6 |
≧8 |
≧15 |
≧15 |
Roughness |
Ra(μm) |
≦0.2 |
Rz(μm) |
0.8-1.5 |
Anti-oxidization |
200℃,≧90Minnondiscolouring |
temperature 85℃,humidity 85%,nondiscolouring |
Solder Resistance |
288℃/10S no bubbles |
Peel Strength(N/㎜) |
≧0.8 |
≧0.8 |
≧1.0 |
≧1.2 |
≧1.2 |
Chemical Resistance(%) |
≦5 |
Surface Quality |
No wrinkles, no color difference, no scratches, no convex and concave points |
Storage Condition |
Temperature 0℃≦t≦25℃,RH≦60%,90 days |
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