Short Description:
| It is widely used in small connectors, contact springs, relay springs, terminals, switch parts, fuse clips, and electronic connectors. | |||||||
| Grade | Chemical composition（%） | Thickness (mm) |
|||||
| GB | ASTM | JIS | Cu | Sn | P | Fe | 0.2-2.0 |
| - | C50715 | - | Balance | 1.7-2.3 | 0.025-0.04 | 0.05-0.15 | |
| Physical properties | |||||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity W(m·K) |
|||
| 8.9 | 121 | 17.6 | 32 | 160 | |||
| Mechanical properties | Bend properties | ||||||
| Temper | Hardness HV |
Tension test | 90°R/T（Thick＜0.8mm） | ||||
| Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | |||
| H02 | 120-165 | 395-500 | 295-415 | ≥16 | 0 | 0 | |
| H04 | 160-190 | 515-600 | 440-545 | ≥6 | 0 | 1 | |
| H06 | 170-200 | 550-625 | 490-570 | ≥5 | 0.5 | 1.5 | |
| H08 | ≥185 | 605-665 | 550-625 | ≥3 | - | - | |
