| Grade | Chemical Composition(%)≥ Microelement(%)≤ | ||||
| Cu | Bi | Pb | P | ||
| ASTM | C10300 | 99.95 | - | - | 0.001-0.005 |
| EN | Cu-PHC | 99.95 | 0.0005 | 0.005 | 0.001-0.006 |
| Physical properties | ||||||
| Density (g/cm³) |
Modulus of elasticity (GPa) |
Thermal expansion coefficient (×10-6/K) |
Electrical conductivity (%IACS) |
Thermal conductivity (W/(m·K)) |
||
| 8.94 | 115 | 17.7 | 96 | 380 | ||
| Mechanical properties | Bend properties | |||||
| Temper | Hardness HV |
Tension test | 90°R/T（Thick≤0.5mm） | |||
| Tensile Strength Rm/MPa |
Yield Strength MPa |
Elongation % |
Good way | Bad way | ||
| H00 | 40-65 | 220-260 | - | ≥33 | 0 | 0 |
| H02 | 65-95 | 240-300 | - | ≥8 | 0 | 0 |
| H04 | 90-110 | 290-360 | - | ≥4 | 0 | 0 |
| H06 | ≥110 | ≥360 | - | ≥2 | 0 | 0.5 |
