Product Detail
Product Tags
| GB |
ISO |
ASTM |
JIS |
| TU1 |
Cu-OF |
C10200 |
C1020 |
| T2 |
Cu-ETP |
C11000 |
C1100 |
| TP1 |
Cu-DLP |
C12000 |
C1201 |
| TP2 |
Cu-DHP |
C12200 |
C1220 |
| GB |
Composition(%) |
| Cu |
P |
O |
Other |
| TU1 |
99.97 |
0.002 |
less than 0.002 |
balance |
| T2 |
99.9 |
- |
- |
balance |
| TP1 |
99.9 |
0.004-0.012 |
- |
balance |
| TP2 |
99.9 |
0.015-0.040 |
- |
balance |
| ASTM |
Composition(%) |
| Cu |
P |
O |
Other |
| C10200 |
99.95 |
0.001-0.005 |
- |
balance |
| C11000 |
99.9 |
- |
- |
balance |
| C12000 |
99.9 |
0.004-0.012 |
- |
balance |
| C12200 |
99.9 |
0.015-0.040 |
- |
balance |
| Grade（China） |
Grade（Japan） |
Temper |
Thickness/mm |
Tensile Strength Rm(N/mm2) |
Elongation A1 1.3% |
Hardness HV |
| T2 T3 TU1 TU2 TP1 TP2 |
C1100 C1020 C1220 |
O60 |
more than 0.15 |
no less than 195 |
no less than 30 |
no less than 70 |
| H01 |
215-295 |
no less than 25 |
60-95 |
| H02 |
245-345 |
no less than 8 |
80-110 |
| H04 |
295-395 |
no less than 3 |
90-120 |
| H06 |
no less than 350 |
|
no less than 110 |
| Classification/um |
12 |
18 |
35 |
| Width/mm |
520 |
520 |
520 |
| Purity(%) |
≧99.9 |
| Density(g/m³) |
8.89 |
| Area Weight(g/㎡) |
107±3 |
160±5 |
311±6 |
| Tensile Strength(N/㎜²) |
Normal |
≧0.5 |
≧1.0 |
≧1.0 |
| 180℃30Min |
≧5 |
≧7 |
≧10 |
| Roughness |
Ra(μm) |
≦0.35 |
| Rz(μm) |
≦2 |
| Anti-oxidization |
200℃,≧90Minnondiscolouring |
| temperature85℃,humidity85%,nondiscolouring |
| Solder Resistance |
288℃/10S no bubbles |
| Peel Strength(N/㎜) |
≧1.0 |
≧1.0 |
≧1.0 |
| Surface Quality |
No wrinkles, no color difference, no scratches, no convex and concave points |
| Storage Condition |
Temperature0℃≦t≦25℃,RH≦60%,90 days |
| Chemical Resistance(%) |
≦5 |
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